CMOS FABRICATION PROCESS:

N-WELL PROCESS:

main steps involved in the fabrication process of n-well CMOS are

• Formation of n-well regions
• define nmos and pmos active areas
• field and gate oxidation(thinox)
• form and pattern polysilicon
• p+ diffusion
• n+ diffusion
• contact cuts
• deposit and pattern metallization
• over glass with cuts for bonding pads
  

P-WELL PROCESS:

main steps involved in the fabrication process of P-well CMOS are

• Formation of P-well regions
• define nmos and pmos active areas
• field and gate oxidation(thinox)
• form and pattern polysilicon
• n+ diffusion
• p+ diffusion
• contact cuts
• deposit and pattern metallization
• over glass with cuts for bonding pads

for detail fabrication process please check out the following link

http://lsmwww.epfl.ch/Education/former/2002-2003/VLSIDesign/ch02/ch02.html#sec_toc

or

click here